Context:
The Union Cabinet, chaired by PM Narendra Modi, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM). These will involve a cumulative investment of ₹4,600 crore, generate 2,034 skilled jobs, and boost India’s electronics manufacturing ecosystem.
Details of the New Projects
1. SiCSem Pvt. Ltd. – Odisha (Bhubaneswar)
- Partner: Clas-SiC Wafer Fab Ltd., UK
- Focus: India’s first commercial Silicon Carbide (SiC) compound semiconductor fab.
- Applications: Missiles, defence, EVs, railways, fast chargers, data centres, consumer appliances, solar inverters.
2. 3D Glass Solutions Inc. – Odisha
- Focus: Vertically integrated advanced packaging & embedded glass substrate unit.
- Technologies: Glass interposers, silicon bridges, 3D Heterogeneous Integration (3DHI) modules.
- Applications: Defence, AI, high-performance computing, RF & automotive, photonics.
3. Advanced System in Package (ASIP) Technologies – Andhra Pradesh
- Partner: APACT Co. Ltd., South Korea.
- Applications: Mobile phones, set-top boxes, automobiles, and other electronics.
4. Continental Device India Pvt. Ltd. (CDIL) – Punjab
- Type: Brownfield expansion in Mohali.
- Products: High-power discrete semiconductors — MOSFETs, IGBTs, Schottky diodes, transistors.
- Applications: EVs, renewable energy, industrial power conversion, telecom.
About India Semiconductor Mission (ISM)
- Launched: 2021
- Nodal Ministry: Ministry of Electronics & IT (MeitY)
- Vision: Make India a global hub for semiconductor design, manufacturing, and innovation.
- Support:
- Funding for fabs, ATMP/OSAT units, and display fabs.
- Design ecosystem aid for startups, MSMEs, academia.
- Talent development — 60,000+ students trained.
